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102026.08

Reaching New Heights! BOPIXEL Completes Series C Financing, Advancing Breakthroughs in the “Bottleneck” Technology Sector
272026.07

BOPIXEL Releases Full Series of 100Gbps High-Throughput CoF Cameras | Building a Next-Generation High-Speed, High-Precision Vision Platform for Advanced Semiconductor Manufacturing and Advanced Packaging Inspection

BOPIXEL Releases Full Series of 100Gbps High-Throughput CoF Cameras | Building a Next-Generation High-Speed, High-Precision Vision Platform for Advanced Semiconductor Manufacturing and Advanced Packaging Inspection
242026.07

Good News | BOPIXEL's 3D Optical System for Wafer-Level Packaging Selected into Beijing’s First-Set Major Technical Equipment Catalog

the 3D Optical System for Wafer-Level Packaging (Model: HRMQP47180M65) developed by Beijing BOPIXEL Technology Co., Ltd. (hereinafter referred to as "BOPIXEL") was successfully listed in the "Beijing 2026 Second Batch of First-Set (Set) Major Technical Equipment Catalog (Semiconductor Field)". It falls under the category of Semiconductor — Integrated Circuit Production Equipment and Key Components — Key Components for Metrology and Inspection Equipment.

CONTACT INFORMATION: Address: 6 / F, Jingdong Technology Building, 76 Zhichun Road, Haidian District, Beijing / 2nd Floor, Building 7, Fengchuang Technology Park, Keji 13th Street Beijing Economic-Technological Development Area, Beijing
Telephone: 010-64754979

Sales Consulting: E-Mail: overseas@bopixel.com
Telephone: 13311070920 Ms.Tracy Dai

Technical Support: E-Mail: support@bopixel.com

PRODUCTS: Structured Light 3D Camera; High Speed Area Scan Camera; HIGH SPEED LINE SCAN CAMERA; DLP Projector; Cr Series Code Reader & Industrial Smart Camera; Ultra-high speed camera; Line Laser 3D Profiler; Frame Grabber

SOLUTIONS: New energy solutions; Semiconductor Solutions; Automotive Industry Solutions; Robot solution; Food and medicine industry; Logistics industry solutions

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