In the deep waters of Advanced Packaging – moving toward high-bandwidth memory multi‑la yer stacking and Cu‑Cu hybrid bonding – traditional 3D metrology is caught in a life‑or‑death trade‑off between resolution and UPH. Faced with ultra‑fine interconnect pitches, nanometer‑level coplanarity requirements, and warpage challenges of ultra‑thin dies, advanced packaging metrology equipment needs a “super‑sensing eye” that redefines the optical boundaries.

Core technology barriers enable a “dimensionality reduction strike” for semiconductor metrology

Ultimate microscopic resolution: 10000 × 10000, 2.74μm ultra‑small pixel
In next‑generation Cu‑Cu direct bonding processes, the bond pad pitch shrinks dramatically to 10μm or even smaller. To accurately resolve this micro‑world, extreme native spatial resolving power is essential.

Sub‑micron physical sampling: The 100‑megapixel ultra‑high‑speed optical interface Scheimpflug 3D metrology full‑frame camera is equipped with a 2.74μm physical pixel, offering extremely high native Nyquist frequency. When paired with a high‑magnification telecentric optical system, it easily breaks through physical limits and delivers sub‑micron spatial grid sampling of wafer surfaces.

Perfect balance between field of view and resolution: With a wide lateral array of up to 10,000 pixels, it breaks the optical law that “high magnification inevitably sacrifices field of view”. While achieving ultimate spatial resolution, it covers an extremely wide field of view (FOV) in a single scan, completely resolving the contradiction between fine‑pitch resolution and large‑area scanning.

Breaking through the optical transmission bottleneck: 100Gbps optical interface direct connection × 113 fps extreme frame rate

Under the stringent requirement of 100% full inspection, massive 3D data throughput must never become a bottleneck for production line UPH.

Ultra‑wideband data flood: Equipped with a next‑generation 100Gbps ultra‑large bandwidth optical interface (e.g., CoaXPress‑over‑Fiber), it provides a latency‑free high‑speed channel for the massive data of 100 megapixels.

On‑the‑fly scanning: With extremely high data throughput, the camera maintains terrifying frame rate performance even during high‑frequency sampling 3D metrology tasks. It completely eliminates the inefficient “move‑stop‑capture” mode, enabling the equipment to achieve high‑speed continuous on‑the‑fly scanning, compressing the full inspection cycle of an entire wafer from “hours” to production‑line‑friendly “minutes”.

Breaking the depth‑of‑field shackles: Deeply customized Scheimpflug optical architecture

To address the depth‑of‑field deficiency caused by large‑angle oblique illumination in high‑precision 3D metrology (e.g., white light phase shifting, non‑coaxial confocal/triangulation), the 100‑megapixel ultra‑high‑speed optical interface Scheimpflug 3D metrology full‑frame camera natively supports extremely stringent Scheimpflug principle tilt adjustment.

Globally sharp, no compromise: Traditional cameras, when shooting at an angle, must stop down the aperture heavily to gain depth of field, leading to drastic light loss and diffraction blur. The Scheimpflug architecture ensures that the entire 10,000‑pixel ultra‑wide FOV is perfectly in focus from edge to center on the tilted projection plane. With the aperture wide open and exceptional light collection, it outputs distortion‑free, high‑contrast, full‑coverage dense 3D point clouds, providing the purest height‑calculation source data for underlying algorithms.

In the era of 3D heterogeneous integration where yield is the lifeline, the 100‑megapixel ultra‑high‑speed optical interface Scheimpflug 3D metrology full‑frame camera injects the ultimate sensing power into your inspection equipment, tackling the following cutting‑edge challenges:

• Cu‑Cu hybrid bonding inspection: High‑speed scanning of nanometer‑level surface flatness, tiny particles, and dishing at ultra‑fine pitches with extreme spatial resolution.

• Micro‑bump 3D full inspection: Perfectly overcomes false signals from highly reflective metal surfaces, accurately extracts 3D topography of tens of millions of micro‑bumps, and ensures strict coplanarity and volume uniformity.

• Ultra‑thin wafer / die warpage analysis: With ultra‑large FOV and ultra‑high‑frequency sampling, it calculates in real time the thermo‑mechanical micro‑deformations and local warpage trends of ultra‑thin dies under complex stress.