RINDO HS Series
The RINDO HS series em bedded structured light 3D camera truly delivers a "ready-to-use out of the box" experience. Its highly integrated design deeply combines high-performance imaging cores with intelligent processing units, and all algorithms are built directly into the camera. Users do not need to configure additional high-performance computers or perform complex software deployment, greatly simplifying the installation and debugging process. It is suitable for high-precision dimensional measurement and appearance defect inspection scenarios in industries such as 3C electronics, semiconductors, new energy, and automotive electronics.
Features
- Integrated plug-and-play design;
- Compact structure with uncompromised performance;
- Fully built-in algorithms with self-sufficient computing power;
- Fast validation and efficient deployment;
- DLP
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All 1280×720 912×1140 1920×1080
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- CMOS Resolution
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All 3M 5M 12M 25M 65M
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- Xy Resolution
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All <5μm <10μm <20μm <50μm <100μm <500μm <1000μm
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- Z-Axis Repeatability
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All <5μm <10μm <20μm <50μm <100μm <500μm <1000μm
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- Frame Rate
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All <=2.5 <=7.5 <=15
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- Light Source
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All Default White Light Default Blue Light
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- Interface
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All GigE USB_3.0 CXP
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- CONTACT INFORMATION
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Address: 6 / F, Jingdong Technology Building, 76 Zhichun Road, Haidian District, Beijing / 2nd Floor, Building 7, Fengchuang Technology Park, Keji 13th Street Beijing Economic-Technological Development Area, Beijing
Telephone: 010-64754979
- Sales Consulting
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E-Mail:
overseas@bopixel.com
Telephone: 13311070920 Ms.Tracy Dai
- Technical Support
- E-Mail: support@bopixel.com
- PRODUCTS
- Structured Light 3D Camera
- High Speed Area Scan Camera
- HIGH SPEED LINE SCAN CAMERA
- DLP Projector
- Cr Series Code Reader & Industrial Smart Camera
- Ultra-high speed camera
- Line Laser 3D Profiler
- Frame Grabber
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