Rindo HR Series 65M Multi-Light System
The RINDO HR Series 65M Multi-Light System elevates high-precision 3D inspection capabilities to new heights with an industry-leading 65 million point cloud data volume. While achieving ultra-large field of view coverage, the system maintains micron-level accuracy, effectively addressing the industry challenge of balancing high resolution and wide field of view.
Boasting ultra-high-resolution imaging performance, this series can clearly capture subtle features such as the coplanarity of solder balls on large-size BGA chips and the wire bond loop height of IGBT aluminum wires. It supports full-field precision measurement of solder ball height, diameter, offset, and wire loop profile, providing reliable 3D data support for semiconductor packaging and power module inspection.
Boasting ultra-high-resolution imaging performance, this series can clearly capture subtle features such as the coplanarity of solder balls on large-size BGA chips and the wire bond loop height of IGBT aluminum wires. It supports full-field precision measurement of solder ball height, diameter, offset, and wire loop profile, providing reliable 3D data support for semiconductor packaging and power module inspection.
Features
- Industry-leading resolution of 9344×7000 enables meticulous detail reproduction;
- Balancing high precision with a large field of view, it effectively meets the dual demands of precision inspection and efficiency;
- Specialized optimization for scenarios such as BGA chip and IGBT aluminum wire inspection enhances detection reliability;
- Full independent R&D of core components ensures independent control of system performance and continuous upgrade capability.
- DLP
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All 1280×720 912×1140 1920×1080
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- CMOS Resolution
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All 3M 5M 12M 25M 65M
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- Xy Resolution
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All <5μm <10μm <20μm <50μm <100μm <500μm <1000μm
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- Z-Axis Repeatability
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All <5μm <10μm <20μm <50μm <100μm <500μm <1000μm
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- Frame Rate
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All <=2.5 <=7.5 <=15
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- Light Source
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All Default White Light Default Blue Light
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- Interface
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All GigE USB_3.0 CXP
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- CONTACT INFORMATION
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Address: 6 / F, Jingdong Technology Building, 76 Zhichun Road, Haidian District, Beijing / 2nd Floor, Building 7, Fengchuang Technology Park, Keji 13th Street Beijing Economic-Technological Development Area, Beijing
Telephone: 010-64754979
- Sales Consulting
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E-Mail:
overseas@bopixel.com
Telephone: 13311070920 Ms.Tracy Dai
- Technical Support
- E-Mail: support@bopixel.com
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