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Bopixel was invited to attend the 9th International Conference on Matter and Radiation at Extremes (ICMRE 2026)
Time: 2026-05-26 14:06:25 Source: BOPIXEL Read: 1502

From May 18 to 22, 2026, the 9th International Conference on Matter and Radiation at Extremes (ICMRE 2026) was grandly held in Xiamen, Fujian Province. Initiated by the China Academy of Engineering Physics in 2016, this conference series has become one of the most authoritative and influential academic exchange platforms in the global field of extreme conditions science. The journal Matter and Radiation at Extremes (MRE) organizes the ICMRE series to provide an open, convenient, and high-level platform for scholars worldwide, facilitating the dissemination and application of advanced knowledge. The conference fully showcased the latest research progress and technological breakthroughs in extreme conditions science globally.

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As a representative enterprise in the field of advanced scientific imaging, Bopixel’s CTO, Mr. Yang Junchao, was invited to attend and delivered an academic lecture titled "High-Performance Cameras and Scientific Imaging Technologies." In his presentation, he systematically outlined the four major challenges in scientific imaging—ultra-high sensitivity (single-photon detection level), ultra-low noise (especially under long exposure times), ultra-high temporal resolution (femtosecond to picosecond transient imaging), and ultra-high continuous imaging speed. He also provided an in-depth analysis of key technologies such as back-illuminated (BSI) sensors, 3D stacked packaging, and vacuum cryogenic cooling in addressing these challenges. The content, which focused on technical bottlenecks and industrialization directions in global scientific imaging, received significant attention from attending experts and scholars.

In addition to the insightful academic presentation, Bopixel showcased three core scientific camera products at the conference exhibition area, drawing numerous experts for discussions: the Wafer Inspection Deep Ultraviolet TDI Line Scan COF Camera, the 3D Structured Light Camera (RINDO HR Series), and the Short-Wave Infrared (SWIR) Area Array Series. These three products are tailored for advanced research and industrial applications including semiconductor front-end inspection, 3D precision measurement, and short-wave infrared imaging, fully demonstrating Bopixel’s independent R&D capabilities in high-end scientific cameras and industrial vision core components.

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The ICMRE 2026 brought together the world’s leading research forces in matter and radiation at extremes. As a representative of China’s independent R&D strength in high-end scientific cameras, Bopixel’s technical report was included in the key agenda of this top-tier international conference, while its core products garnered attention from international experts. This recognition not only affirms the company’s innovation capabilities but also marks the gradual emergence of domestically developed scientific imaging equipment on the global stage, providing critical visual technology support for cutting-edge fundamental research worldwide.