RINDO HRDOF Series
The RINDO HRDOF Series introduces the new 21M model, which retains the series' ultra-depth-of-field technology advantages while further expanding single-acquisition field of view coverage. This achieves a synergistic improvement in both large FOV and high precision, significantly increasing inspection throughput per unit time.
Suitable for high-precision 3D inspection of semiconductor wire bonding—including gold wire loop profiles and solder ball morphology—the model's expanded large FOV capability also enables efficient dimensional measurement and appearance inspection of precision 3C components (such as curved surface profile tolerance and complex geometries), providing flexible vision solutions for precision manufacturing across multiple industries.
Suitable for high-precision 3D inspection of semiconductor wire bonding—including gold wire loop profiles and solder ball morphology—the model's expanded large FOV capability also enables efficient dimensional measurement and appearance inspection of precision 3C components (such as curved surface profile tolerance and complex geometries), providing flexible vision solutions for precision manufacturing across multiple industries.
Features
- Upgraded Inspection Speed – Engineered for high-speed inline detection
- Algorithm Optimization – Significantly enhanced Z-axis repeatability
- Ultra-Large Depth of Field – Stable performance on complex surfaces
- Application-Optimized – Specifically tailored for semiconductor wire bonding and precision component dimensional measurement
- CONTACT INFORMATION
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Address: 6 / F, Jingdong Technology Building, 76 Zhichun Road, Haidian District, Beijing / 2nd Floor, Building 7, Fengchuang Technology Park, Keji 13th Street Beijing Economic-Technological Development Area, Beijing
Telephone: 010-64754979
- Sales Consulting
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E-Mail:
overseas@bopixel.com
Telephone: 13311070920 Ms.Tracy Dai
- Technical Support
- E-Mail: support@bopixel.com
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