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​Good News | BOPIXEL's 3D Optical System for Wafer-Level Packaging Selected into Beijing’s First-Set Major Technical Equipment Catalog
Time: 2026-07-24 16:42:53 Source: Bopixel Read: 5674

Recently, the 3D Optical System for Wafer-Level Packaging (Model: HRMQP47180M65) developed by Beijing BOPIXEL Technology Co., Ltd. (hereinafter referred to as "BOPIXEL") was successfully listed in the "Beijing 2026 Second Batch of First-Set (Set) Major Technical Equipment Catalog (Semiconductor Field)". It falls under the category of Semiconductor — Integrated Circuit Production Equipment and Key Components — Key Components for Metrology and Inspection Equipment.


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This marks another major achievement for BOPIXEL following its "8K 1MHz Deep Ultraviolet (DUV) TDI Line Scan Camera", which earned the "First-Set" certification in 2025. Receiving "First-Set" major technical equipment certifications in the integrated circuit sector for two consecutive years highlights the company's strong technological capability in the semiconductor field.


The "First-Set Major Technical Equipment" certification mainly targets innovative equipment and core components that achieve significant technological breakthroughs and possess independent intellectual property rights. It serves as an authoritative recognition of a company's technological innovation, engineering capability, and industrial application value.

Receiving this certification for two consecutive years (2025 and 2026) in the integrated circuit field not only reflects BOPIXEL's continuous investment and expertise in key semiconductor imaging components, but also proves that domestic high-end optical imaging core components are progressively breaking through overseas technological barriers and advancing into the core segments of the global industry chain.