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BOPIXEL Releases Full Series of 100Gbps High-Throughput CoF Cameras | Building a Next-Generation High-Speed, High-Precision Vision Platform for Advanced Semiconductor Manufacturing and Advanced Packaging Inspection
Time: 2026-07-27 16:45:52 Source: BOPIXEL Read: 7907

As advanced semiconductor manufacturing continues to evolve, inspection and metrology systems are simultaneously facing multiple challenges: higher resolution, higher frame rates, larger fields of view, and superior stability. Particularly in critical processes such as wafer metrology, advanced packaging, CoWoS, 3D inspection, and high-speed inline AOI, traditional 50Gbps-class data transmission platforms have gradually become a significant bottleneck limiting overall system performance.

In response to the urgent demand for high-speed, high-throughput, low-latency, and highly reliable imaging platforms in next-generation semiconductor inspection equipment, Beijing BOPIXEL Technology Co., Ltd. (BOPIXEL) officially announces the full series release of its 100Gbps High-Throughput CoF Cameras. Built on a unified 100G QSFP28 high-speed optical fiber platform, this series establishes a comprehensive product matrix covering 12MP, 26MP, 50MP, 68MP, and 105MP, fully addressing multi-level application requirements from high-speed inline inspection to ultra-high-precision metrology.

This release represents not only an upgrade in product specifications, but also a leap forward in vision platforms for advanced semiconductor manufacturing. Powered by the 100Gbps high-throughput CoF architecture, BOPIXEL provides the industry with a next-generation industrial vision solution that combines ultra-high bandwidth, ultra-long-distance transmission, exceptional stability, and scalable platform capabilities.

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