Recently, Beijing BOPIXEL Technology Co., Ltd. (hereinafter referred to as “BOPIXEL”) officially announced the successful completion of its Series C financing round. The investment was jointly led by three prestigious institutions: CITIC Securities Investment, Beijing Jingguoguan Equity Investment Fund, and Mount Everest Venture Capital. Following the strategic investment from the China Internet Investment Fund in 2025, this financing represents another strong recognition from the capital market of BOPIXEL’s technological capabilities and growth potential.
As a leading company in the field of optical imaging components for integrated circuits, BOPIXEL has been consecutively selected for the Beijing Integrated Circuit First Set (First-of-a-Kind) Equipment and Components Directory for two consecutive years. The company has also been approved to establish the Beijing Key Laboratory of Semiconductor Deep Ultraviolet Light Source Technology and selected for the Capital High-level Talent Development Program. These milestones demonstrate BOPIXEL’s strong capabilities in the strategic sectors of hard-core technology innovation, critical technology breakthroughs, and domestic substitution.
From developing deep ultraviolet (DUV) TDI cameras that filled domestic technology gaps, to creating extreme ultraviolet (EUV) vacuum cameras that break international technological barriers, and leading the global market for Hybrid Bonding optical alignment solutions, BOPIXEL has consistently focused on achieving independent and controllable core components for the semiconductor industry.
The proceeds from this financing round will accelerate breakthroughs in optical sensing, advanced materials, and other underlying technologies, further strengthening BOPIXEL’s innovation capabilities. By delivering more “BOPIXEL solutions” to the semiconductor industry, the company aims to help China’s semiconductor ecosystem achieve clearer vision, stronger independence, and greater global competitiveness.